一 综合词汇

印制电路：printed circuit

印制线路：printed wiring

印制板：printed board

印制板电路：printed circuit board (pcb)

印制线路板：printed wiring board(pwb)

印制元件：printed component

印制接点：printed contact

印制板装配：printed board assembly

板：board

单面印制板：single-sided printed board(ssb)

双面印制板：double-sided printed board(dsb)

多层印制板：mulitlayer printed board(mlb)

多层印制电路板：mulitlayer printed circuit board

多层印制线路板：mulitlayer prited wiring board

刚性印制板：rigid printed board

刚性单面印制板：rigid single-sided printed borad

刚性双面印制板：rigid double-sided printed borad

刚性多层印制板：rigid multilayer printed board

挠性多层印制板：flexible multilayer printed board

挠性印制板：flexible printed board

挠性单面印制板：flexible single-sided printed board

挠性双面印制板：flexible double-sided printed board

挠性印制电路：flexible printed circuit (fpc)

挠性印制线路：flexible printed wiring

刚性印制板：flex-rigid printed board, rigid-flex printed board

刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed

刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board

齐平印制板：flush printed board

金属芯印制板：metal core printed board

金属基印制板：metal base printed board

多重布线印制板：mulit-wiring printed board

陶瓷印制板：ceramic substrate printed board

导电胶印制板：electroconductive paste printed board

模塑电路板：molded circuit board

模压印制板：stamped printed wiring board

顺序层压多层印制板：sequentially-laminated mulitlayer

散线印制板：discrete wiring board

微线印制板：micro wire board

积层印制板：buile-up printed board

积层多层印制板：build-up mulitlayer printed board (bum)

积层挠印制板：build-up flexible printed board

表面层合电路板：surface laminar circuit (slc)

埋入凸块连印制板：b2it printed board

多层膜基板：multi-layered film substrate(mfs)

层间全内导通多层印制板：alivh multilayer printed board

载芯片板：chip on board (cob)

埋电阻板：buried resistance board

母板：mother board

子板：daughter board

背板：backplane

裸板：bare board

键盘板夹心板：copper-invar-copper board

动态挠性板：dynamic flex board

静态挠性板：static flex board

可断拼板：break-away planel

电缆：cable

挠性扁平电缆：flexible flat cable (ffc)

薄膜开关：membrane switch

混合电路：hybrid circuit

厚膜：thick film

厚膜电路：thick film circuit

薄膜：thin film

薄膜混合电路：thin film hybrid circuit

互连：interconnection

导线：conductor trace line

齐平导线：flush conductor

传输线：transmission line

跨交：crossover

板边插头：edge-board contact

增强板：stiffener

基底：substrate

基板面：real estate

导线面：conductor side

元件面：component side

焊接面：solder side

印制：printing

网格：grid

图形：pattern

导电图形：conductive pattern

非导电图形：non-conductive pattern

字符：legend

标志：mark

二 基材：

基材：base material

层压板：laminate

覆金属箔基材：metal-clad bade material

覆铜箔层压板：copper-clad laminate (ccl)

单面覆铜箔层压板：single-sided copper-clad laminate

双面覆铜箔层压板：double-sided copper-clad laminate

复合层压板：composite laminate

薄层压板：thin laminate

金属芯覆铜箔层压板：metal core copper-clad laminate

金属基覆铜层压板：metal base copper-clad laminate

挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film

基体材料：basis material

预浸材料：prepreg

粘结片：bonding sheet

预浸粘结片：preimpregnated bonding sheer

环氧玻璃基板：epoxy glass substrate

加成法用层压板：laminate for additive process

预制内层覆箔板：mass lamination panel

内层芯板：core material

催化板材：catalyzed board ,coated catalyzed laminate

涂胶催化层压板：adhesive-coated catalyzed laminate

涂胶无催层压板：adhesive-coated uncatalyzed laminate

粘结层：bonding layer

粘结膜：film adhesive

涂胶粘剂绝缘薄膜：adhesive coated dielectric film

无支撑胶粘剂膜：unsupported adhesive film

覆盖层：cover layer (cover lay)

增强板材：stiffener material

铜箔面：copper-clad surface

去铜箔面：foil removal surface

层压板面：unclad laminate surface

基膜面：base film surface

胶粘剂面：adhesive faec

原始光洁面：plate finish

粗面：matt finish

纵向：length wise direction

模向：cross wise direction

剪切板：cut to size panel

酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)

环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)

环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates

环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates

环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates

聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates

聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates

双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates

环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates

聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates

超薄型层压板：ultra thin laminate

陶瓷基覆铜箔板：ceramics base copper-clad laminates

紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates

三 基材的材料

a阶树脂：a-stage resin

b阶树脂：b-stage resin

c阶树脂：c-stage resin

环氧树脂：epoxy resin

酚醛树脂：phenolic resin

聚酯树脂：polyester resin

聚酰亚胺树脂：polyimide resin

双马来酰亚胺三嗪树脂：bismaleimide-triazine resin

丙烯酸树脂：acrylic resin

三聚氰胺甲醛树脂：melamine formaldehyde resin

多官能环氧树脂：polyfunctional epoxy resin

溴化环氧树脂：brominated epoxy resin

环氧酚醛：epoxy novolac

氟树脂：fluroresin

硅树脂：silicone resin

硅烷：silane

聚合物：polymer

无定形聚合物：amorphous polymer

结晶现象：crystalline polamer

双晶现象：dimorphism

共聚物：copolymer

合成树脂：synthetic

热固性树脂：thermosetting resin

热塑性树脂：thermoplastic resin

感光性树脂：photosensitive resin

环氧当量：weight per epoxy equivalent (wpe)

环氧值：epoxy value

双氰胺：dicyandiamide

粘结剂：binder

胶粘剂：adesive

固化剂：curing agent

阻燃剂：flame retardant

遮光剂：opaquer

增塑剂：plasticizers

不饱和聚酯：unsatuiated polyester

聚酯薄膜：polyester

聚酰亚胺薄膜：polyimide film (pi)

聚四氟乙烯：polytetrafluoetylene (ptfe)

聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)

增强材料：reinforcing material

玻璃纤维：glass fiber

e玻璃纤维：e-glass fibre

d玻璃纤维：d-glass fibre

s玻璃纤维：s-glass fibre

玻璃布：glass fabric

非织布：non-woven fabric

玻璃纤维垫：glass mats

纱线：yarn

单丝：filament

绞股：strand

纬纱：weft yarn

经纱：warp yarn

但尼尔：denier

经向：warp-wise

纬向：weft-wise, filling-wise

织物经纬密度：thread count

织物组织：weave structure

平纹组织：plain structure

坏布：grey fabric

稀松织物：woven scrim

弓纬：bow of weave

断经：end missing

缺纬：mis-picks

纬斜：bias

折痕：crease

云织：waviness

鱼眼：fish eye

毛圈长：feather length

厚薄段：mark

裂缝：split

捻度：twist of yarn

浸润剂含量：size content

浸润剂残留量：size residue

处理剂含量：finish level

浸润剂：size

偶联剂：couplint agent

处理织物：finished fabric

聚酰胺纤维：polyarmide fiber

聚酯纤维非织布：non-woven polyester fabric

浸渍绝缘纵纸：impregnating insulation paper

聚芳酰胺纤维纸：aromatic polyamide paper

断裂长：breaking length

吸水高度：height of capillary rise

湿强度保留率：wet strength retention

白度：whitenness

陶瓷：ceramics

导电箔：conductive foil

铜箔：copper foil

电解铜箔：electrodeposited copper foil (ed copper foil)

压延铜箔：rolled copper foil

退火铜箔：annealed copper foil

压延退火铜箔：rolled annealed copper foil (ra copper foil)

薄铜箔：thin copper foil

涂胶铜箔：adhesive coated foil

涂胶脂铜箔：resin coated copper foil (rcc)

复合金属箔：composite metallic material

载体箔：carrier foil

殷瓦：invar

箔（剖面）轮廓：foil profile

光面：shiny side

粗糙面：matte side

处理面：treated side

防锈处理：stain proofing

双面处理铜箔：double treated foil

四 设计

原理图：shematic diagram

逻辑图：logic diagram

印制线路布设：printed wire layout

布设总图：master drawing

可制造性设计：design-for-manufacturability

计算机辅助设计：computer-aided design.(cad)

计算机辅助制造：computer-aided manufacturing.(cam)

计算机集成制造：computer integrat manufacturing.(cim)

计算机辅助工程：computer-aided engineering.(cae)

计算机辅助测试：computer-aided test.(cat)

电子设计自动化：electric design automation .(eda)

工程设计自动化：engineering design automaton .(eda2)

组装设计自动化：assembly aided architectural design. (aaad)

计算机辅助制图：computer aided drawing

计算机控制显示：computer controlled display .(ccd)

布局：placement

布线：routing

布图设计：layout

重布：rerouting

模拟：simulation

逻辑模拟：logic simulation

电路模拟：circit simulation

时序模拟：timing simulation

模块化：modularization

布线完成率：layout effeciency

机器描述格式：machine descriptionm format .(mdf)

机器描述格式数据库：mdf databse

设计数据库：design database

设计原点：design origin

优化（设计）：optimization (design)

供设计优化坐标轴：predominant axis

表格原点：table origin

镜像：mirroring

驱动文件：drive file

中间文件：intermediate file

制造文件：manufacturing documentation

队列支撑数据库：queue support database

元件安置：component positioning

图形显示：graphics display

比例因子：scaling factor

扫描填充：scan filling

矩形填充：rectangle filling

填充域：region filling

实体设计：physical design

逻辑设计：logic design

逻辑电路：logic circuit

层次设计：hierarchical design

自顶向下设计：top-down design

自底向上设计：bottom-up design

线网：net

数字化：digitzing

设计规则检查：design rule checking

走（布）线器：router (cad)

网络表：net list

计算机辅助电路分析：computer-aided circuit analysis

子线网：subnet

目标函数：objective function

设计后处理：post design processing (pdp)

交互式制图设计：interactive drawing design

费用矩阵：cost metrix

工程图：engineering drawing

方块框图：block diagram

迷宫：moze

元件密度：component density

巡回售货员问题：traveling salesman problem

自由度：degrees freedom

入度：out going degree

出度：incoming degree

曼哈顿距离：manhatton distance

欧几里德距离：euclidean distance

网络：network

阵列：array

段：segment

逻辑：logic

逻辑设计自动化：logic design automation

分线：separated time

分层：separated layer

定顺序：definite sequence

五 形状与尺寸：

导线（通道）：conduction (track)

导线（体）宽度：conductor width

导线距离：conductor spacing

导线层：conductor layer

导线宽度/间距：conductor line/space

第一导线层：conductor layer no.1

圆形盘：round pad

方形盘：square pad

菱形盘：diamond pad

长方形焊盘：oblong pad

子弹形盘：bullet pad

泪滴盘：teardrop pad

雪人盘：snowman pad

v形盘：v-shaped pad

环形盘：annular pad

非圆形盘：non-circular pad

隔离盘：isolation pad

非功能连接盘：monfunctional pad

偏置连接盘：offset land

腹（背）裸盘：back-bard land

盘址：anchoring spaur

连接盘图形：land pattern

连接盘网格阵列：land grid array

孔环：annular ring

元件孔：component hole

安装孔：mounting hole

支撑孔：supported hole

非支撑孔：unsupported hole

导通孔：via

镀通孔：plated through hole (pth)

余隙孔：access hole

盲孔：blind via (hole)

埋孔：buried via hole

埋/盲孔：buried /blind via

任意层内部导通孔：any layer inner via hole (alivh)

全部钻孔：all drilled hole

定位孔：toaling hole

无连接盘孔：landless hole

中间孔：interstitial hole

无连接盘导通孔：landless via hole

引导孔：pilot hole

端接全隙孔：terminal clearomee hole

准表面间镀覆孔：quasi-interfacing plated-through hole

准尺寸孔：dimensioned hole

在连接盘中导通孔：via-in-pad

孔位：hole location

孔密度：hole density

孔图：hole pattern

钻孔图：drill drawing

装配图：assembly drawing

印制板组装图：printed board assembly drawing

参考基准：datum referan